| The customer required a flexible machine that would be able to assemble several
different devices using multiple bonding techniques.
In addition, the design of the device was expected
to change in the future, so the automation was expected
to be flexible enough to accommodate these changes.
The devices typically contain parts that are less than
1 mm square, need to be located and aligned to within
10 µm or less, and bonded into place with epoxy or
solder.
AEi based its solution
on its PMAT Platform and FlexAuto software, enabling
users to configure
the machine to use different machine vision analysis
tools to accurately pick and place components during
alignment and attach operations. The system also dynamically
integrates adhesive bond and solder attachment modes
for the specific recipe of sub-components under assembly.
The system’s suite of control algorithms quickly executes
alignment functions and configures adaptive tooling
to support a wide range of precision component designs
with the additional advantage of being able to accommodate future device changes.
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